Semiconductor packaging is carried out to provide extra protection to wafers or substrates. The package casing is made up of materials such as metal, plastic, glass, or ceramic and contains one or more semiconductor electronic components.
Semiconductor packaging offers the following benefits to wafers:
Covered in this report:
The report covers the present scenario and the growth prospects of the global semiconductor packaging equipment market for 2016-2020. To calculate the market size, the report considers the sale of semiconductor packaging equipment to the end-users - OSATs and IDMs.
The market is divided into the following segments based on geography:
Key vendors
http://www.radiantinsights.com/research/global-semiconductor-packaging-equipment-market-2016-2020/request-sample
Key questions answered in this report
Semiconductor packaging offers the following benefits to wafers:
- Prevents corrosion
- Offers protection in case of impact
- Dissipates heat produced in the device
- Secures the contact leads or pins used to plug in the device to its external circuits
Covered in this report:
The report covers the present scenario and the growth prospects of the global semiconductor packaging equipment market for 2016-2020. To calculate the market size, the report considers the sale of semiconductor packaging equipment to the end-users - OSATs and IDMs.
The market is divided into the following segments based on geography:
- APAC
- Europe
- North America
Key vendors
- Applied Materials
- ASM Pacific Technology
- Kulicke and Soffa Industries
- Tokyo Electron Limited
- Tokyo Seimitsu
- ChipMos
- Greatek
- Hua Hong
- Jiangsu Changjiang Electronics Technology
- Lingsen Precision
- Nepes
- Tianshui Huatian
- Unisem
- Ultratech
- High demand for polymer adhesive wafer bonding equipment
- For a full, detailed list, view our report
- Fluctuation of foreign exchange rates
- For a full, detailed list, view our report
- Growing number of mergers and acquisitions
- For a full, detailed list, view our report
http://www.radiantinsights.com/research/global-semiconductor-packaging-equipment-market-2016-2020/request-sample
Key questions answered in this report
- What will the market size be in 2020 and what will the growth rate be?
- What are the key market trends?
- What is driving this market?
- What are the challenges to market growth?
- Who are the key vendors in this market space?
- What are the market opportunities and threats faced by the key vendors?
- What are the strengths and weaknesses of the key vendors?
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